Advanced Semiconductor Packaging Improves Application with Increasing Focus on Wafer-level Packages and Emergence of FO-WLP Technology

The global advanced semiconductor packaging market is prognosticated to become the focus of attention as wafer-level packages increase their application in the chip industry. Advent of advanced packaging solutions is said to be helped with rising emphasis on the use of wafer-level packages. Wafer size is researched to be key for the development of advanced semiconductor packaging technology. Considering quick advancement in technology, 2.5D packaging could be replaced by fan-out wafer-level packaging (FO-WLP). In comparison with some conventional packaging technologies that could manage only a single die, FO-WLP holds the ability to handle multiple dies.

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Advanced semiconductor packaging types such as flip chip (FC) are predicted to gather more demand in the global market. Moreover, FC advanced semiconductor packaging is expected to collect a larger market share compared to other types because of the following factors.

  1. High I/O density

  2. Lower profile

  3. Faster signal transfer

Small packages are observed to be used on a large scale due to high demand for thinner, smaller, and lighter consumer products. When it comes to application, central/graphical processing units are projected to secure a higher amount of share of the world advanced semiconductor packaging market.

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Advanced semiconductor packaging vendors are envisaged to find lucrative growth opportunities in a range of end-use industries. However, the consumer electronics industry could raise higher demand for advanced semiconductor packaging in the near future. This demand is foretold to gain strength with rise in purchase of connected consumer electronics such as wearable devices, smartphones, and tablets.

  1. Consumer electronics
  2. Industrial
  3. Medical devices
  4. Aerospace and defense
  5. Automotive
  6. Telecommunications

In the meantime, system-in-package (SIP) technology is forecasted to gradually gain impetus due to its facility of integrating more features into wearable devices, medical implants, and small form factors (SFFs).

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APEJ could also bank on availability of cheap raw material and low labor cost to increase its share in the international advanced semiconductor packaging market. China is observed to invest strongly in the improvement of chip packaging manufacturing facilities and focus on three-dimensional integrated circuit (3D IC) and other advanced technologies.

Advanced Semiconductor Packaging Improves Application with Increasing Focus on Wafer-level Packages and Emergence of FO-WLP Technology

The global advanced semiconductor packaging market is prognosticated to become the focus of attention as wafer-level packages increase their application in the chip industry. Advent of advanced packaging solutions is said to be helped with rising emphasis on the use of wafer-level packages. Wafer size is researched to be key for the development of advanced semiconductor packaging technology. Considering quick advancement in technology, 2.5D packaging could be replaced by fan-out wafer-level packaging (FO-WLP). In comparison with some conventional packaging technologies that could manage only a single die, FO-WLP holds the ability to handle multiple dies.

Between 2017 and 2026, the global advanced semiconductor packaging market is foreseen in a report authored by Transparency Market Research (TMR) to post a CAGR of 10.9%. By the end of 2026, the market could be valued at a US$67.2 bn.

In a recent news report, Mi Equipment is expected to ride high on advanced semiconductor packaging. Supposed to complete in Q1 2019, the company’s new Bayan Lepas factory in Penang Island, Malaysia could see relocation of existing operations. The factory bears an expansive production floor space projected to raise production capacity by almost four times.

FC Offering Faster Signal Transfer to Account for Lion’s Market Share

Advanced semiconductor packaging types such as flip chip (FC) are predicted to gather more demand in the global market. Moreover, FC advanced semiconductor packaging is expected to collect a larger market share compared to other types because of the following factors.

  • High I/O density
  • Lower profile
  • Faster signal transfe

Small packages are observed to be used on a large scale due to high demand for thinner, smaller, and lighter consumer products. When it comes to application, central/graphical processing units are projected to secure a higher amount of share of the world advanced semiconductor packaging market.

Consumer Electronics to Lead Market with Telling Demand for Connected Devices

Advanced semiconductor packaging vendors are envisaged to find lucrative growth opportunities in a range of end-use industries. However, the consumer electronics industry could raise higher demand for advanced semiconductor packaging in the near future. This demand is foretold to gain strength with rise in purchase of connected consumer electronics such as wearable devices, smartphones, and tablets.

  • Consumer electronics
  • Industrial
  • Medical devices
  • Aerospace and defense
  • Automotive
  • Telecommunications

In the meantime, system-in-package (SIP) technology is forecasted to gradually gain impetus due to its facility of integrating more features into wearable devices, medical implants, and small form factors (SFFs).

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APEJ to Exhibit Prominence with Development of New Semiconductor Packages

Asia Pacific except Japan (APEJ) is envisioned to emerge as a significant contributor to the international advanced semiconductor packaging market. Demand in the APEJ market could be pushed by certain favorable factors mentioned below.

  • Presence of leading semiconductor manufacturing companies
  • Development of new semiconductor packages with advanced features
  • Heavy investment in research and development activities

APEJ could also bank on availability of cheap raw material and low labor cost to increase its share in the international advanced semiconductor packaging market. China is observed to invest strongly in the improvement of chip packaging manufacturing facilities and focus on three-dimensional integrated circuit (3D IC) and other advanced technologies.