Gaining advantage from the shortcomings of discrete LED array, chip-on-board (COB) LED array is gaining traction as new depositing arrangement of LEDs for high-power devices. The chip-on-board LED arrangement requires foresight on part of the LED maker. It involves matching individual LEDs and design a suitable substrate to transport the light engine.
COB LED array enables far more valuable offering. It allows LED makers to take leverage efficiency-enhancing techniques such as remote phosphor. This is a win-win situation for both the LED maker and user for energy saving. Such economic advantages of COB LED array hints at promising growth of the chip-on-board LED market.
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Chip-on-board LED array addresses problems of design and assembling in a LED array. Firstly, COB LED arrays do not require lighting manufacturers to deposit individual LEDs on a printed circuit board. The arrangement also saves LED makers to involve another party to do the placing of LEDs.
COB LED array has other advantages too. COB LED array supports manual assembly during manufacturing process. As such, COB can be joined with epoxy or mechanically fastened with heatsink without the need to employ substantial engineering resources. This serves to boost the COB LED market.
Compelling Initiatives of LED makers boosts Growth
The COB LED market witnesses notable participation from LED manufacturers. At present, several LED manufacturers are introducing a new category of products with COB LED arrays. For example, LED maker Cree has recently launched a new COB LED arrangement that it has termed XLamp CXA solution. LEDs placed using XLamp CXA solution doubles the system intensity of spotlights as compared to intensity of predecessor arrays, claims the maker.
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Cree’s first product developed with this breakthrough technology is CXA 1520 LED. The configuration enables lighting manufacturers to develop products that deliver luminosity that of a 39 W ceramic metal halide device. That too with 50 percent less power.