San Francisco, California, July 07, 2017: The demand for system-in-package tie technologies is rising in response to the swelling popularity of miniaturization in the electronics industry. In a report, titled “System-in-Package (SiP) Die Technologies Market – Global Industry Analysis, Market Size, Share, Trends, Analysis, Growth, and Forecast 2017 – 2025,” TMR Research presents a detailed analysis of the various factors chalking strong growth for the market. Refined outlook focusing on the market’s trajectory between 2017 and 2025 is provided in the report for the benefit of the market players. Besides this, the market study also presents insights into the prevailing trends likely to influence the global system-in-package (SiP) die technologies market.
Using SiP, active electronic components are arrangekd into a single unit to function in a more organized manner. Furthermore, it provides furthers development of advanced but affordable electronic products. Against this backdrop, the global SiP die technologies market is expected to gain impetus from factors such as the innovation of compact consumer electronic devices, the need to create ceiling for rising costs, and curb the rising number of semiconductor fabrication plants. In addition, the advent of the Internet of Things, besides existing design complexities in system-on-chip (SoC) market has helped the market record stellar growth in the past.
On the downside, high inventory levels prevailing in supply chain and fluctuating foreign exchange rates are two of the key challenges holding back the global SiP die technologies market from achieving its full growth potential. Additionally, setting up an infrastructure conducive to the technologies require huge investment, which is hindering the entry of prospective vendors. Nevertheless, the advent of fan-out wafer level packaging platform and growth witnessed in outsources semiconductor assembly will enable the market traverse a positive curve in the forthcoming years. Besides this, the rising demand for automation in the automotive industry will be a key to growth for the market in the near future.
To provide a comprehensive overview of the global SiP die technologies market, the report segments it based on various parameters. In terms of end use, the market is categorized into retail, medicine, scientific research, consumer electronics, defense and surveillance, automotive, industrial, instrumentation, and telecommunications. Based on type of raw material used, the market can be bifurcated into silicon and compound semiconductors. Regionally, Asia Pacific, North America, Europe, and Rest of the World constitute the key market segments. Furthermore, on the basis of technology, the market can be segmented into ball grid array, pin grid array, surface mountpackage, small outline packages, and flat packages.
Besides, analyzing the various factors supporting and inhibiting the market’s trajectory across the aforementioned segments, the report also profiles some of the key market players such as Jiangsu Changjiang Electronics Technology Co., Chipmos Tech. Inc., Ase Inc., Chipbond Technology Corporation, Qualcomm Incorporated, Amkor Technology Inc., Powertech Technologies Inc., Fujitsu Ltd., Stats Chippac Ltd, Nanium SA, and Toshiba Corporation.